Kungani slicer yenkomo kanye nemvu unezicucu ezindizayo?

Ukwenzeka kwama-flakes andizayo kusho ukuthi kulula ukwenzeka lapho ukusika nokusikwa kwe-wafer kuphelela kuphalethi yegraphite. Lokhu kungenxa yokuthi amandla okungqubuzana kwe-blade ku-wafer makhulu kakhulu futhi i-graphite pallet ayikwazi ukubekezelela, okuholela esimweni sokuthi i-wafer ithathwa yi-blade.

Kungabonakala ekuhlaziyeni okungenhla ukuthi kukhona uketshezi lokusika phakathi kwensingo ye-slitter blade kanye ne-wafer, futhi i-blade inamandla okuphikisanayo ku-wafer. Ubukhulu bamandla aphikisanayo bulingana nendawo yokusika kanye nesilinganiso sokugeleza koketshezi lokusika, ngakho nciphisa izinga lokugeleza koketshezi lokusika. Indlela ingaxazulula ukwenzeka kwama-flakes endizayo.

Kusukela ekusebenzeni kwangempela, sithole ukuthi lapho umkhawulo wokusika we-wafer yokusika unamaconsi okusika, umcimbi wezingcezu ezindizayo uzovela kalula. Lokhu kungenxa yokuthi ukugeleza koketshezi lokusika kukhulu kakhulu, okwandisa ukungqubuzana futhi kubangele ukwenzeka kwezingcezu ezindizayo. . Ngakho-ke, izinga lokugeleza koketshezi lokusika akufanele libe likhulu kakhulu, futhi izinga lokugeleza lokupholisa kanye nokugcoba emaphethelweni okusika linganeliseka.